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   A WORLD CLASS PRINTED CIRCUIT BOARD SUPPLIER
Capacity Plan
Layer Distribution ( plan )
Brief of process capability

　
Brief of process capability in Victory Circuit China
　
Layer count                           2~10 layers.
　
O/L Min. L/S mil ( mm)          3.5 / 3.5 ( 0.085 / 0.085 )
　
I/L Min. L/S, mil ( mm )          3 / 3 ( 0.075 / 0.075 )
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Smallest via., Mil (mm )         7.8 ( 0.2 )
　
Thinnest core, mil (mm)        2 ( 0.05 )
　
Board thickness ( mm )         0.2 ~ 2.5
　
Impedance TOL.                    +/- 8%
　
Aspect ratio                           8 : 1
　
Smallest via ring, mil             4
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Materials                               FR-4 Tg-150,Tg-158,Tg-170,Tg-180; Halogen free
　
Finishes                                 Im-Ag, OSP, ENIG, gold finger, HASL
　
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